工作內容：
You will be at the forefront of our business expansion. This role focuses exclusively on the Pre-award Phase of ODM projects. As the technical brain and driving force behind new project development, you will lead cross-functional R&D teams under highly challenging timelines to transform ambiguous customer requirements into commercially competitive technical proposals. You must possess both the logical mindset of an engineer and the sharp acumen of a business professional, delicately balancing specifications, costs, and schedules to help the company secure flagship projects from global brands.
Key Responsibilities: 1. Lead the RFI/RFQ Evaluation Process: Upon receiving initial customer requirements, rapidly establish evaluation baselines and assumptions. Initiate and lead cross-functional R&D teams (EE, ME, Thermal, RF, etc.) to conduct technical Feasibility Studies.
2. Technical Pitching & Communication: Transform complex hardware architectures into highly persuasive commercial technical presentations (R&D Proposals). Partner with the Sales team to pitch to customers, handle technical Q&A, and showcase the company's R&D capabilities.
3. Cross-Functional Coordination & Negotiation: In resource-constrained environments, leverage your influence to coordinate evaluation progress across various R&D departments to meet aggressive deadlines.
4. Cost & NRE Assessment: Collaborate closely with Sales and Engineering teams to accurately estimate the system BOM cost and Non-Recurring Engineering (NRE) expenses. Proactively guide the team through specification trade-offs or design optimizations when costs exceed targets.
Minimum Qualifications: 1. Education: Bachelor’s or Master’s degree, preferably in Electrical, Electronic, Mechanical Engineering, Computer Science, or Engineering Management.
2. Industry Experience: 3+ years of experience in the system manufacturing industry (PC, Laptops, or Networking products), with at least 3 years as a TPM, PM, or R&D Engineer. Deep understanding of hardware system architectures and the NPI development process.
3. Language Skills: Fluent in English (capable of directly conducting meetings, presentations, and technical negotiations with international brand customers).
Core Traits: 1. Tolerance for Ambiguity: Courageous enough to make reasonable assumptions and drive projects forward even with incomplete information.
2. Extreme Resilience & Time Management: Capable of multitasking under tight timeframes, remaining organized and focused when facing high-pressure deadlines.
3. Business Acumen: Highly sensitive to numbers, able to find the optimal balance between technical integrity and commercial profitability.
1. Previous background as an R&D Engineer (EE, ME, etc.), enabling deeper technical dialogues with the development team.2. Familiarity with the product development processes and communication cultures of Tier-1 brand customers (e.g., HP, Dell, Lenovo).3. Quotation/RFQ Expertise: Profound understanding of BOM cost structures. Proven hands-on experience in RFQ pricing and NRE estimation.
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