工作內容:
1. Technology development for FSM (Front-Side Metallization by sputtering), Backside Grinding, BM (Backside Metallization/TiNiV/Ag sputtering), CP test, GaN backend, and Package/FT related. 2. BGBM/CP customer’s NTO handling, product qualification, and mass production management. 3. Backend business management in cost and financial, marketing survey. 4. Technology involved: Ti, Al, NiV, Ag sputtering, wafer grinding, etching, Cu plating, TSV, GaN on Ceramic grinding/dicing…etc.